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Model Number: D255-#8651
Brand Name: XINYA
Key Specifications/Special Features:
Ceramicdiamond grinding wheel are special used for grindingSemiconductors material, such as silicone, sapphireSpecial diamond grinding wheel for semiconductors material have the highest sharpness and the best grinding effectThey are designed for grinding the surface of silicone waferand sapphire wafer.For reducing the thickness of thesiliconwaferand sapphire wafer.
Shipping Information:
- FOB Port: Shanghai
- Lead Time: 10 - 15 days
Main Export Markets:
- Asia
- Australasia
- Central/South America
- Eastern Europe
- Mid East/Africa
- North America
- Western Europe